Chemical mechanical planarization is a process used in semiconductor industry to remove bulk materials so as to achieve plane and smooth surfaces. Increasing demand from semiconductor and electronics industry is a major factor driving growth of the global chemical mechanical planarization market. Stringent government regulations for use of slurries and abrasives, limit the growth of CMP market.

The global chemical mechanical planarization market is segmented on the basis of type, application, and region. On the basis of type, the global market is segmented into CMP equipment and CMP consumables. The global market of CMP consumables is sub-segmented into slurry, pad, pad conditioner and others such as cleaning solutions and PVA brushes. The CMP consumables segment is expected to witness highest growth over the forecast period.

On the basis of application, the global market is segmented into integrated circuits, microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), compound semiconductors, and optics. The MEMS and NEMS segment accounts for highest share in terms of revenue and is expected to witness highest growth over the forecast period.

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On the basis of region, the target market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The Asia Pacific market is expected to account for highest share in terms of revenue in the global market by 2026. Increasing demand from semiconductor and electronics industry in countries in this region is a major factor driving growth of the Asia Pacific chemical mechanical planarization market. The markets in North America is expected to register significant growth over the forecast period, followed by Europe market. The market in Latin America is projected to witness moderate growth in coming years.

Key players in the global market are Applied Materials, Inc., Lapmaster Wolters GmbH, Strasbaugh Inc., Cabot Microelectronics Corporation, Fujimi Incorporated, Air Products & Chemicals Inc., Ebara Corporation, LAM Research Corporation, Okamoto Machine Tool Works Ltd., DOW Electronic Materials, and Hitachi Chemical Company Ltd.

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